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UK facility reveals iPhone 16 design change secret

UK facility reveals iPhone 16 design change secret
UK facility reveals iPhone 16 design change secret

There have been rumors of a new change coming to the iPhone 16 series, which Apple is expected to announce in September.

The British newspaper The Telegraph reports that Apple plans to make significant updates to the Face ID system, enhancing user authentication, improving photo quality, and enhancing augmented reality experiences.

According to the source, Coherent, a US semiconductor company with a microchip plant in the UK that provided components for the Face ID system, is shutting down.

It appears that Apple, the facility’s primary customer, no longer requires Coherent to produce components for them due to the company’s decision to implement changes to the Face ID system for the iPhone 16 family.

The report lacks specific details about the changes Apple plans to make, but it does mention that the system will undergo a major overhaul and include a smaller module than previously. This could potentially result in Apple reducing the size of the Dynamic Island, which is where the sensors and camera hardware are located.

It is not anticipated that the Face ID system will be integrated under the screen until at least 2025, so Apple could potentially enhance the appearance of the iPhone 16 by reducing the size of the Dynamic Island. We do not have any inside information about Apple’s intentions, and it is conceivable that any reported modifications may solely enhance the functionality of Face ID without impacting the design of the iPhone 16.

DigiTimes has confirmed The Telegraph’s report and also mentioned that the iPhone 16 series will include design changes related to Face ID.

Before the release of the iPhone 16, which is still several months away, it is probable that we will learn more about the upgraded Face ID technology.

According to previous rumors, the Pro models will come with a larger screen, while the regular models will have a revamped rear camera setup. The entire range is expected to include a new Capture button and will be powered by chipsets utilizing TSMC’s N3E technology.

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